The objective of this project is to develop novel experiments and models for characterizing and managing warpage in advanced packages that use high-density organic substrates, to provide more flexibility to design robust multi-chiplet systems via heterogeneous integration.
Research
Research
Characterization of Warpage in Advanced Packages with Organic Substrates
- UT Austin PI: Rui Huang
- CO-PIs: Kenneth M. Liechti
- Funding Source: Semiconductor Research Corporation (SRC)
- Award: $315K
- Award Date: 1/1/25 - 12/31/27
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