Advancing Interfacial Fracture Analysis in Semiconductor Packages through Integrated DIC Methods and Cohesive Zone Modeling

The focus of this innovative research is on enhancing the understanding of interfacial fracture behavior in semiconductor packaging. By developing advanced experimental techniques like Digital Image Correlation (DIC) and Digital Volume Correlation (DVC), Yang aims to characterize material properties in both 2D and 3D multilayered structures, which are crucial for the next generation of semiconductor technologies. These methods will provide high-fidelity data that will improve predictive modeling and the overall reliability of semiconductor packages. Learn more.